Piezoelectric-Thermal Co-Simulation of Bulk Acoustic Wave Devices

Hongyu Bai,Min Tang,Junfa Mao
DOI: https://doi.org/10.1109/apcap56600.2022.10069561
2022-01-01
Abstract:In this paper, a piezoelectric-thermal co-simulation of bulk acoustic wave (BAW) devices based on the finite element method (FEM) is proposed. Firstly, the piezoelectric analysis is performed in the frequency domain, and the heat source is obtained through mechanical loss and dielectric loss. Then, the temperature distribution is calculated based on the steady-state heat transfer. After that, the value of temperature-dependent material is updated for the piezoelectric simulation. The above process continues until the convergence of results is achieved. In order to accelerate the convergence, the Aitken acceleration method is utilized. Numerical results illustrate the validity and efficiency of the proposed method.
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