Abstract:As the critical dimensions of semiconductor manufacturing processes gradually decrease, the requirements for production yield management become increasingly stringent. During the manufacturing process, there are many different types of defects, such as micron-sized particles, millimeter-sized scratches, etc. Multiple categories and different scales bring great challenges to the detection and identification of defects. This paper provides a full-flow surface defect identification method based on spot scanning scattering for unpatterned wafers. First, an adaptive threshold method with dynamic kernel windows is used to perform line-by-line scanning inspection of the wafer Mercator image. The 3σ decision strategy is used to avoid the impact of defects on background estimation and to improve detection sensitivity. After morphological processing, connected domain analysis is performed to obtain the defect mask, and feature information such as the shape, size, and distribution of the defect is extracted. Finally, the defect identification is performed by rules based binning, and the identified defects are converted into wafer polar coordinate image for display and analysis. In the experiments, the proposed method is used to identify micron-scale particles as well as large scratches on the millimeter scale for SiC wafers. Relative to the actual production rate requirement of 20 wafers per hour, the analysis time for a 6-inch wafer is 24.4 s, which can meet the requirement. Meanwhile, the test results illustrate the effectiveness of the method. The proposed method is recommended for early-stage defect detection and identification of unpatterned wafers.

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