Abstract:In aerospace applications, some devices, instruments and equipment suffer the harsh environment, as extremely low temperature and wide temperature ranges for instance. The solder joints which are fragile and sensitive to the thermal and mechanical environment are part of the electronic control systems that are important to the devices. Sn-based alloy has been the mostly used solder material of electronic circuit in recent years. Sn-based solder alloy has better performance such as low melting point and good plasticity. However, it shows brittle behavior at low temperatures and brittle failures may eventually lead to catastrophic failures. Study on mechanical behaviors of Sn-based solder alloy at cryogenic temperatures becomes more and more important. Charpy test was performed to measure the dissipated energy in the impact process. There were 6 kinds of solder alloys, as follows: Sn, 99.3Sn0.7Cu, 96.5Sn3Ag0.5Cu, 62Sn36Pb2Ag, 63Sn37Pb, 10Sn90Pb. There is obvious ductile-to-brittle transition for all the Pb-free solders at lower temperature. For Sn solder, this transition begins between -40 °C and -60 °C. The ductile-to-brittle transition temperature (DBTT) of 96.5Sn3Ag0.5Cu solder is between -30°C and -40°C which is higher than Sn solder. When adding Pb to solder, the toughness will be so perfect that the ductile-to-brittle transition tend to be gradual and not obvious. The results shows that for Sn solder the fracture modes have both intergranular fracture and transgranular fracture. A rod-like structure has been found in 99.3Sn0.7Cu solder and 96.5Sn3Ag0.5Cu solder that it facilitates transgranular fracture. The composition of the specific structure is likely to be Cu6Sn5 for 99.3Sn0.7Cu solder and Ag 3 Sn for 96.5Sn3Ag0.5Cu solder measured by EDS (Energy Disperse Spectroscopy). Ag 3 Sn particles are observed in the fracture morphology of 62Sn36Pb2Ag solder and the fracture mode is quasi-cleavage fracture.

Anisotropy of Hardness and Impression Morphology in Body-Centered Tetragonal Tin (sn) at Cryogenic Temperature and Room Temperature

Revealing the Ductile-to-brittle Transition Mechanism in Polycrystalline Body-Centered Tetragonal Tin (sn) for Cryogenic Electronics

Mechanical Properties and Microstructure of Sn-based Solder Joints at Cryogenic Temperature

Solidification behavior of Sn crystals − Under different temperature gradients

Effect of Ag 3 Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder During in Situ Tensile Test at Low Temperature

Deformation Behavior and Constitutive Equation of Sn-37Pb Solder Alloy at Cryogenic Temperature

Interfacial Endogenous Stress-Induced Phase-Stress Partition in Tin-Lead Dual-Phase Alloy at Cryogenic Temperature

Fracture Behavior and Constitutive Relations of Sn-3.0Ag-0.5Cu Solder Alloy at Cryogenic Temperature

Ductile-to-brittle transition in fracture behaviors of common solder alloys over a temperature range down to −150 °C

Mechanical Properties and Fracture Mechanisms of Sn-3.0Ag-0.5Cu Solder Alloys and Joints at Cryogenic Temperatures

Fracture pattern evolution of SnAgCu–SnPb mixed solder joints at cryogenic temperature

The Mechanism Study of Low-Temperature Brittle Fracture of Bulk Sn-based Solder

Influence of Low Temperature on Tensile Properties and Fracture Behavior of Sn3Ag0.5Cu Solder Alloy

Mechanical Properties and Microstructure of Mixed SnAgCu-SnPb Solder Joints at Cryogenic Temperature

Enhance cryogenic ductility and strength of body-centered tetragonal Sn by pre-twinning and recrystallization

Role of Grain Orientation in the Failure of Sn-Based Solder Joints under Thermomechanical Fatigue

Maximum Shear Stress-Controlled Uniaxial Tensile Deformation and Fracture Mechanisms and Constitutive Relations of Sn–Pb Eutectic Alloy at Cryogenic Temperatures

Microstructural Evolution and Mechanical Properties of Sn‐58Bi Solder Alloys with Different Cooling

Mechanical properties degradation of Sn-37Pb solder joints caused by interfacial microstructure evolution under cryogenic temperature storage

Effect of Grain Orientation on Mechanical Properties and Thermomechanical Response of Sn-Based Solder Interconnects

Phase Transformations and Mechanical Properties in In–Bi–Sn Alloys as a Result of Low-Temperature Storage