Significant Enhancement of Negative Thermal Expansion Under Low Pressure in Cu2P2O7
Naike Shi,Longlong Fan,Yuanji Xu,Wen Yin,Huaican Chen,Bao Yuan,Chang Zhou,Jun Chen
DOI: https://doi.org/10.1002/smll.202312289
IF: 13.3
2024-06-27
Small
Abstract:A significant enhancement in negative thermal expansion (NTE) in Cu2P2O7 under low pressure is achieved. The volumetric coefficient of thermal expansion (CTE) reached −50.0 × 10−6 K−1 (150–325 K) under 0.25 GPa, 47.5% stronger than NTE under atmospheric pressure. Pressure accelerated contraction between CuO layers and columns, enhancing the low‐frequency phonon contribution to NTE in α‐Cu2P2O7. Much effort is made to achieve the negative thermal expansion (NTE) control, but rare methods reached the improvement of intrinsic NTE. In the present work, a significantly enhanced NTE is realized in Cu2P2O7 by applying low pressure. Especially, the volumetric coefficient of thermal expansion (CTE) of Cu2P2O7 reached to −50.0 × 10−6 K−1 (150–325K) under 0.25 GPa, which is increased by 47.5% compared to its NTE in a similar temperature range under atmosphere pressure. This character enables a more effective manifestation of the thermal compensation role of Cu2P2O7 in composites. The enhanced NTE mechanisms are analyzed by high pressure synchrotron X‐ray diffraction, neutron diffraction at variable temperature and pressure, as well as density functional theory (DFT) calculations. The results show that applied pressure accelerates the contraction of the distance between adjacent CuO layers and CuO columns. Meanwhile, the low‐frequency phonon contribution to NTE in α‐Cu2P2O7 is improved. This work is meaningful for the exploration of methods to enhance NTE and the practical application of NTE materials.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology