A Multiscale Attention Mechanism Super-Resolution Confocal Microscopy for Wafer Defect Detection
Xuefeng Sun,Baoyuan Zhang,Yushan Wang,Jialuo Mai,Yuhang Wang,Jiubin Tan,Weibo Wang
DOI: https://doi.org/10.1109/tase.2024.3358693
IF: 6.636
2024-01-01
IEEE Transactions on Automation Science and Engineering
Abstract:Confocal microscopy is an essential component of wafer defect detection systems. Wafers are raw materials used in the manufacture of semiconductor chips. The semiconductor chip manufacturing process undergoes frequent updates, which cause an increase in the number and types of defects. This leads to lengthy scanning times for large wafers, and warrants the need to enhance the throughput of optical microscopy inspections. To address this issue, we propose the use of the multi-scale residual dilated convolution attention mechanism network (MRDCAN) super-resolution reconstruction algorithm to reproduce high-resolution images from low-magnification objective lens acquired images. The algorithm introduces the attention mechanism to enhance the information richness of wafer images, introduces the multi-scale expansion convolution to expand the convolutional sensor field to eliminate artefacts to enrich the detailed information of wafer image contours, and meets the image quality requirements through the loss calculation method based on the combination of mean-square error (MSE) and structural similarity (SSIM) image evaluation indices. It is shown that the reconstruction of low-resolution wafer images using this algorithm breaks the optical diffraction limit and achieves the purpose of improving the wafer image resolution. Compared with state-of-the-art models, the proposed algorithm can achieve the best performance with an SSIM index of 94.26 percent for the reconstructed super-resolution wafer images. Our algorithm provides fresh insights into the current challenges of confocal microscopy in the field of wafer defect detection Note to Practitioners—Shrinking semiconductor wafer sizes and increasingly complex inspection steps lead to reduced throughput of optical microscope inspection systems. Current convolutional neural network (CNN) networks cannot solve the problem of super-resolution of complex wafer images well. This seriously affects their application in practical detection. Compared with other algorithms, the super-resolution reconstruction algorithm proposed in this paper has a short training time and a multi-scale structure that effectively prevents the loss function curve from oscillating. And the reconstructed wafer image achieves obvious advantages in terms of visual effect and evaluation indices, with strong robustness to Gaussian noise. In addition, the final discussion shows that high-resolution images can be reproduced through the combination of low-magnification objective lens and deep learning super-resolution algorithm, which can simplify the steps of wafer defect detection and increase the efficiency of the whole wafer defect detection by more than 100%. This study demonstrates the potential of super-resolution confocal microscopy for wafer defect detection.
automation & control systems