Abstract:Creep poses a significant threat to the integrity and longevity of structural components at high-temperature. The most current understanding of creep mainly focuses on the coupled dynamics of point defects and dislocation, which may well describe the first and second stage of creep. However, the behavior of the three stages of creep is jointly controlled by point defect (vacancy) diffusion, dislocation glide, dislocation climb, grain boundary (GB) sliding, and void evolution. A critical knowledge gap still exists regarding how these different creep mechanisms are simultaneously coupled during the three stages of creep. In this work, a multi-physical mechanisms-based crystal plasticity model is proposed to consider the concurrent evolution of point defect, dislocation, GB, and void based on a unified thermodynamic framework. In-situ scanning electron microscope creep experiments and macroscopic creep experiments of Ti-6Al-4V were conducted to validate our model. The in-situ creep experiment directly revealed the GB sliding creep failure behavior of Ti-6Al-4V for the first time. The proposed model well predicts both the microscopic and macroscopic experimental behavior of creep. The contribution of different microstructure evolutions is discussed, and a phase diagram of the dominated creep mechanism is obtained. An in-depth analysis was conducted on the coupling effects and microstructure characteristics of different creep mechanisms. This work not only deepens our understanding of the micro creep mechanism but also offers valuable insights for designing materials with specific microstructures to enhance their creep resistance.

Size-dependent to Size-Independent Transition in Creep of Single Crystalline Cu Micropillars

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Characteristic Sizes for Exhaustion-Hardening Mechanism of Compressed Cu Single-Crystal Micropillars

Unified Model for Size-Dependent to Size-Independent Transition in Yield Strength of Crystalline Metallic Materials.

A stochastic crystal plasticity model with size-dependent and intermittent strain bursts characteristics at micron scale

A Micropillar Compression Simulation by A Multiscale Plastic Model Based on 3-D Discrete Dislocation Dynamics

Size dependence of creep behavior in nanoscale Cu/Co multilayer thin films

SIZE EFFECT ON DEFORMATION MODE IN MICRON-SIZED Ti-5Al SINGLE CRYSTAL LOADED ALONG $[2\,\overline 1 \,\overline 1 \,0]$ AND [0001]

Effects of size on the mechanical response of metallic glasses investigated through in situ TEM bending and compression experiments

Size dependence of dislocation-mediated plasticity in Ni single crystals: molecular dynamics simulations

Atypical Three-Stage-hardening Mechanical Behavior of Cu Single-Crystal Micropillars

Size effect in bi-crystalline micropillars with a penetrable high angle grain boundary

Temperature Insensitivity of the Flow Stress in Body-Centered Cubic Micropillar Crystals

A Crystal Plasticity-Based Creep Model Considering the Concurrent Evolution of Point Defect, Dislocation, Grain Boundary, and Void

Molecular dynamics study on the grain size, temperature, and stress dependence of creep behavior in nanocrystalline nickel

Microscale crystal slip and macroscopic cold creep transition in dwell fatigue

Quantitative evidence of crossover toward partial dislocation mediated plasticity in copper single crystalline nanowires.

Strain-rate and size dependence of gradient lamellar nickel investigated by in-situ micropillar compression

Investigation of compressive creep of calcium-silicate-hydrates (C-S-H) in hardened cement paste through micropillar testing

Size effects on dislocation starvation in Cu nanopillars : A molecular dynamics simulations study