Effect of Solder Composition on the Growth Behavior of Interfacial Compounds on (001) Cu and Polycrystalline Cu During Aging

Chong Dong,Tianhao Guo,Haoran Ma,Haitao Ma,Yunpeng Wang
DOI: https://doi.org/10.1016/j.matchar.2022.112380
IF: 4.537
2022-01-01
Materials Characterization
Abstract:The intermetallic compounds at the reaction interface will continue to grow during solid-state aging and the reliability of the solder joint will be affected by the growth behavior and orientation of intermetallic compounds. In the paper, the effect of solder composition, i.e., Sn and Sn3Ag, on the growth behavior of Cu3Sn on (001) Cu and polycrystalline Cu during aging are compared. Besides, the effect of solder composition on the orientation evolution of Cu6Sn5 on (001) Cu is investigated. Results indicate that the thickness of the Cu3Sn layer in the Sn3Ag/(001)Cu joint is larger than that in Sn3Ag/polycrystalline Cu joint, but the difference in Cu3Sn thickness between Sn/(001)Cu and Sn/polycrystalline Cu is small. Besides, the addition of Ag is beneficial to maintaining the preferred orientation of Cu6Sn5 on (001) Cu during solid-state aging. The results are beneficial to improve the reliability of solder joints.
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