Self-Limited ultraviolet laser sintering of liquid metal particles for m-Thick flexible electronics devices

Dong Ye,Zihan Peng,Jinxu Liu,YongAn Huang

DOI: https://doi.org/10.1016/j.matdes.2022.111189

IF: 9.417

2022-01-01

Materials & Design

Abstract:Lightweight, deformable and highly conductive conductors are rather appealing in flexible electronics devices such as electromagnetic interference (EMI) shielding films; however, the most commonly used metallic foils or carbon nanomaterials suffer from critical limitation of either film thickness or electrical conductivity. Herein, we present a facile approach to rapidly fabricate sintered liquid metal submicron particles (LMSPs) films in combination spray-coating with direct nanosecond ultraviolet (UV) laser sintering. High conductive, lm-thick sintered LMSPs films were prepared owing to the self-limited penetration depth of UV laser, and their sheet resistances are easily tuned at least seven orders of magnitude by the laser processing parameters. A calculated parametric map upon particle diameter and laser fluence whether or not a liquid metal particle is ruptured has been obtained and it is quite well in accordance to the experiment results. Such laser-sintered LMSPs films are finally utilized to fabricate shielding films with superior EMI shielding effectiveness (SE) of similar to 33 dB and specific EMI SE over thickness (SSE/t) of similar to 27500 dB.cm(2).g(-1), and flexible electromagnetic metamaterials with a high absorption above 99.9 % at resonance frequency of 12.9 GHz and 14.3 GHz, showing their high potential for flexible EMI shielding and electromagnetic wave absorption applications. (C) 2022 The Authors. Published by Elsevier Ltd.