Experimental investigation on enhanced flow and heat transfer performance of micro-jet impingement vapor chamber for high power electronics
Li Yi,Haozhong Hu,Chao li,Ying Zhang,Shu Yang,Minqiang Pan
DOI: https://doi.org/10.1016/j.ijthermalsci.2021.107380
IF: 4.779
2022-03-01
International Journal of Thermal Sciences
Abstract:In this study, two novel micro-jet impingement vapor chamber configurations, including separated micro-jet impingement vapor chamber (SJVC) and integrated micro-jet impingement vapor chamber (IJVC), were designed and tested. The flow character and thermal performance of SJVC were investigated and compared with the traditional liquid cooling vapor chamber (separated microchannel vapor chamber, SCVC). The experimental and simulation results show that although the heat transfer performance of SJVC is slightly worse than SCVC, its flow performance and temperature uniformity have obvious advantages over SCVC (SCVC pressure drop is 1.49–1.77 times that of SJVC). Therefore, the comprehensive performance of SJVC is better than SCVC. To verify the heat transfer advantages of integrated heat sink, the heat transfer performance of SJVC and IJVC was also compared. The experimental results show that the thermal resistance of IJVC is even smaller, and the IJVC heater temperature is lower, indicating that the heat transfer performance of heat sink module could be further improved when designed as an integrated structure. In sum, SJVC and IJVC have promising application potentials in thermal management of high power electronic devices, and the research results have certain guiding significance to the development of efficient heat transfer technology for high heat flux applications.
engineering, mechanical,thermodynamics