Automatic Placement Algorithm of Integrated Circuits for Wire Bond Packaging Application

J. Wan,HC. Wang
DOI: https://doi.org/10.1109/cstic55103.2022.9856898
2022-01-01
Abstract:In this work, we have explored the automatic placement algorithm of chips during wire bond packaging based on multi-objective optimization technique. We use genetic algorithm to optimize the chip's position and angle during packaging. Pareto front is obtained indicating the best compromise with performances, such as the distance between the wires, wire length and so on. Optimization with up to four objectives has been successfully demonstrated.
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