Abstract:Microbumps play a crucial role in interlayer interconnections for advanced packaging. Among the prevalent microbump structures are Cu/Sn and Cu/Ni/Sn configurations. However, as the bump size continues to shrink, excessive Kirkendall voids tend to form in Cu/Sn microbumps, leading to potential reliability issues. While Cu/Ni/Sn structures can suppress Kirkendall void formation, Ni3Sn4 intermetallic compound (IMC) exhibits inferior physical properties compared to Cu3Sn and Cu6Sn5. In this study, a novel Cu/Ni/Cu/Sn1.8Ag (CNCT) Sn-rich microbump structure with controlled Cu thickness is proposed to suppress Kirkendall void formation while promoting Cu6Sn5 and Cu3Sn as interfacial IMCs. A Ni barrier layer is inserted to partition the Cu pillar and impede Cu atom replenishment from the bottom side. The remaining Cu pillar at the top is designed to be 3μm thick, which is intended to be fully consumed by 8μm Sn1.8Ag solder while simultaneously serving as redundant protection for the bottom Cu pillar against unexpected Sn spillage. The effects of high temperature storage (HTS) at 150°C on IMC evolution in CNCT microbump bonding were investigated for 1500hours. No significant voids were observed at the bonding interface during HTS. Interfacial positions recorded from 0 to 500hours show that the Cu3Sn IMC grows unidirectionally toward the Cu side but not toward the Sn side, indicating a greater diffusion flux of Sn atoms compared to Cu atoms. The diffusion coefficients of Cu in Cu3Sn (DCu,ε), Cu6Sn5 (DCu,η), and Sn in Cu3Sn (DSn,ε), Cu6Sn5 (DSn,η) at 150°C were calculated as 1.36×10-18m2/s, 5.01×10-19m2/s, 9.53×10-19m2/s and 1.10×10-18m2/s, respectively. The dramatic decrease of DCu,η suggests that the diffusion capacity of Cu atoms into Sn is significantly suppressed. The notable transformation of Cu3Sn to Cu6Sn5 occurred after 500hours. By 1500hours, Cu3Sn was greatly consumed, and the bonding interface tended to form a stable Cu/Ni/Cu6Sn5/Ni/Cu structure. Diffusion models were established and discussed to elucidate the mechanisms governing both stages.

Study on the evolution of interfacial (Cu,Ni)<sub>6</sub>Sn<sub> 5</sub> and shear property of (111)Cu/Sn/Ni micro joints under isothermal and TG-bonding

Study on the evolution of interfacial (Cu,Ni)6Sn5 and shear property of (111)Cu/Sn/Ni micro joints under isothermal and TG-bonding

Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient

Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints

Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test

Microstructure, Interfacial Reactions and Mechanical Properties of Co/Sn/Co and Cu/Sn/Cu Joints Produced by Transient Liquid Phase Bonding

Interfacial structures and mechanical properties of Cu/Sn/Cu containing SiC nanowires under transient liquid phase bonding

Nickel Interlayer on the Microstructure and Property of TC6 to Copper Alloy Diffusion Bonding

Interfacial Reaction and Mechanical Properties for Cu/Sn/Ag System Low Temperature Transient Liquid Phase Bonding

A Cu/Ni/Cu/Sn1.8Ag Microbump Structure for Void-free Interface under Long Time High-Temperature Storage

Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding

Wetting Behavior and Interfacial Reactions of Sn/Cu-xNi Couples for High Temperature Application

Mechanical Property Of Cu-Sn-Ni Intermetallics In The Full Intermetallic Micro-Joints Formed With Transient Liquid Phase Soldering

Study on Cu6Sn5 Morphology and Grain Orientation Transition at the Interface of (111) Nt-Cu and Liquid Sn

Mechanical properties of SnSb4.5CuNi/Cu joints during isothermal aging

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints

Influence of Ni particle addition on grain refinement of Cu-Sn intermetallic compound joints bonded at various temperatures

Intermetallic compound evolution and mechanical properties of Cu/Sn58Bi/Cu 3D structures blended with B 4 C nanoparticles during isothermal aging

Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding

Enhanced reliability of Cu-Sn bonding through the microstructure evolution of nanotwinned copper