Degradation Mechanism of Electric Joint Compound Which Uesd in DC Terminal Connectors

X. Wei,Z. Jia,X. Wang
DOI: https://doi.org/10.1049/icp.2020.0325
2021-01-01
Abstract:DC Terminal Connectors frequently face with abnormal fever problems due to the increase of contact resistance. The degradation of electric joint compounds is mainly responsible for the increasement. However, the degradation mechanism of electric joint compound is unclear. In this paper, artificial accelerated aging tests were put on the electric joint compounds to simulating their aging mode. The conductivity of DC terminal connectors was measured during the thermo-oxidative aging progress. Micro structural analysis tests including FTIR, XPS, XRD were used to proclaim the changes of the electric joint compounds. It is concluded that the increase of crosslinking extent and the volatilization of small molecule siloxanes, have great impact on the operation performance of the electric joint compounds.
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