Analysis on Damage and Failure Behavior of Printed Silver Wires under High-Density Current Loading

Quan Sun,Yebo Lu,Chengli Tang,Chao Li,Chuncheng Zuo

DOI: https://doi.org/10.1016/j.microrel.2022.114484

2022-01-01

Abstract:As the electrical connections of different functional components, printed silver wires are widely used in flexible electronics. With the development trend toward miniaturization and high-performance enhancement, the current density in electronic devices increases continuously. The damage and failure of interconnects under high-density current, including Joule heating, electromigration (EM) and thermomigration (TM), becomes a severe problem in the development of flexible electronics. In this study, the failure behavior of printed silver wires under high-density current was investigated by experiments and finite element simulation. The results demonstrated that TM, instead of EM, dominates the atoms migration in the printed silver wire while it was subjected to high-density current at room temperature in the air, and hillocks were generated on the two sides of the middle part of the silver wire due to the existence of a significant temperature gradient along the width direction in this area. In addition, the influence of silver wire defects on the failure behavior of the silver wire was also analyzed. The results indicated that defects in the silver wire can result in local increase of temperature and more significant temperature gradients in the defective area due to Joule heating which can accelerate the TM phenomenon in the local area and eventually lead to open-circuit failure of the silver wire failed. Thus, in order to improve the lifespan of silver wire under current loading, it is important to minimize the temperature gradient in the silver wire while working, especially to reduce defects in silver wire printing.