Electromigration and electrical sintering in printed silver from high current at room temperature

Uidam Jung,Ryan Wagner
DOI: https://doi.org/10.1088/2058-8585/ad5454
IF: 3.1
2024-06-06
Flexible and Printed Electronics
Abstract:Improved understanding of the reliability and failure physics of metal nanoparticle conductive inks would facilitate their large-scale deployment across a range of flexible electronics applications. We conduct room-temperature electromigration experiments on printed silver nanoparticle conductive ink test devices. We observe significant variation in failure time, location, and structure during these tests and during post-failure analysis with optical and electron microscopy. We use in-situ Atomic Force Microscopy measurements to track volume changes in the sample as a function of time. These measurements provide additional data and understanding of the failure process within printed silver nanoparticle conductive inks.
materials science, multidisciplinary
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