Abstract:With the dramatic requirements of high power and high integrity in field of power devices, the study of novel interconnection materials and packaging methods has been paid an extremely attention. Presently, the most candidates for the chip bonding are Zn-based, Bi-based, noble-metal-based (such as Au-Sn, Au-Ge, Au-Si), nano-metal particles (Ag or Cu nanoparticles) and transient-liquid-phase (TLP) bonding. However, a high bonding temperature and poor ductility for Zn-based solder (more than 420°C) causing irreversible damages or accelerated aging affects to the electronic devices; Bi-based solder alloys are still under way mainly due to their inferior thermal and electrical conductivity as well as poor workability; It's worth noting that nano-silver sintering and TLP bonding technology have been proven to be the potential solutions to the power electronic packaging, because their processing temperatures are relatively low and the produced joints are of high re-melting temperatures. However, Ag is expensive and easy to electromigration, which will influence the stability/reliability of the joints and hinder to universal industry applications. For the TLP bonding, the process to produce full intermetallic compounds (IMCs) is time-consuming, commonly more than 60 min, due to relatively low reaction velocity. To solve the problem of time-consuming of the TLP, an enhanced and low-cost auxiliary energy is necessary. Ultrasonic-assisted soldering has been proven able to solder dissimilar metals at low temperatures within a very short time. In our previous work, a full Cu6Sn5/Cu3Sn IMCs joint through TLP assisted by ultrasound was obtained. Because of the acoustic cavitation and streaming effect created by ultrasonic waves propagating in molten alloys, the atom diffusion and physical-chemical interactions were accelerated at the liquid/solid interfaces. However, a sole IMC joint with single phase has not been fabricated so far. High re-melting temperature joint consisted of nearly sole Ni 3 Sn 4 with a high shear strength of 43.4 MPa was achieved with Sn-24 wt.%Ni by ultrasonic-assisted soldering for 10 s. This rapidly formed intermetallic joint was phase-stable as isothermally aged at 300 °C for 72 h in air and its shear strength was 33.4 MPa due to the Ni 3 Sn 4 grains coarsening. These results demonstrate that the less time-consuming ultrasonic-assisted soldering has wide potentials for high-temperature power electronic packaging.

Evolution of Interfacial IMCs and Mechanical Performance of Joints of Mg/Al Dissimilar Metals Soldered by Using Ga-coating Protection

Control Al/Mg Intermetallic Compound Formation During Ultrasonic-Assisted Soldering Mg to Al.

Effects of Zn on Intermetallic Compounds and Strength of Al/Mg Joints Ultrasonically Soldered in Air

Formation and Evolution of Intermetallic Compounds at Interfaces of Cu/Al Joints by Ultrasonic-Assisted Soldering

Interfacial structure of the joints between magnesium alloy and mild steel with nickel as interlayer

Interfacial Microstructure Evolution and Mechanical Properties of Al/Sn Joints by Ultrasonic-Assisted Soldering

Intermetallic Compound Growth Behavior and Mechanical Performance in Sn58Bi/Cu Solder Joint Bearing Mg Particles Incorporation During Thermal Aging

Improving Weld Strength of Arc-Assisted Ultrasonic Seam Welded Mg/Al Joint with Sn Interlayer

Control of Mg2Sn Formation Through Ultrasonic-Assisted Transient Liquid Phase Bonding of Mg to Al

Interfacial Microstructure and Mechanical Properties of Al/Mg Butt Joints Made by MIG Welding Process with Zn-Cd Alloy As Interlayer

Microstructure Evolution of Mg/Cu Dissimilar Metal Jointed by Ultrasonic-Induced Transient Liquid Phase Bonding with Zn Interlayer

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Joining of Magnesium and Aluminum Via Arc-Assisted Ultrasonic Seam Welding with Sn/Zn Composite Interlayer

Rapid Formation of Intermetallic Joints with Sn/metal Composite Alloys by Ultrasonic-Assisted Soldering for High-Temperature Chip Attachment

Evolution of IMC Layer and Its Reinforcing Effect in 2024/MB8 Dissimilar Joints Using a Multi-Interlayer of Cu/Zn Via U-TLP Bonding

Dissimilar Joining of Pure Aluminum to SiCp/Al-MMCs Using an AlMgGaLi Active Interlayer Foil

Effects of interlayer metal on microstructures and mechanical properties of friction stir lap welded dissimilar joints of magnesium and aluminum alloys

Interfacial Reactions Between Sn-Cu Solder Alloy and Cu/Ni Coatings During Reflow Soldering

Improving Shear Strength of Sn-3.0Ag-0.5Cu/Cu Joints and Suppressing Intermetallic Compounds Layer Growth by Adding Graphene Nanosheets

Microstructure and Properties of Magnesium Alloy Joints Bonded by using Gallium with the Assistance of Ultrasound at Room Temperature

Growth behavior and reliability of interfacial IMC for Sn58Bi/Cu and Sn58Bi-AlN/Cu solder joints applied in IGBT modules