Abstract:In the work, thermal cycling reliability of graphene nanosheets-doped Sn– x Ag–Cu/Cu solder joint ( x = 1, 2, and 3 wt.%) was investigated. With different Ag content, Ag 3 Sn IMCs formed in solder matrix displayed different morphologies, number, and sizes. They played a synergistic role in enhancing the joint's thermal cycling reliability with graphene nanosheets, the mechanism of which was fully clarified in our work. Experimental results showed that the increased Ag content and trace doping of graphene nanosheets into Sn– x Ag–Cu/Cu solder joints enhanced their initial shear strength, thus allowing them to maintain a higher strength level during the whole thermal cycling. Electron Backscatter Diffraction results showed that graphene nanosheets-doped solder joints fractured from the solder matrix, and further from the interfacial IMC interlayer with a mixed feature of ductile and brittle. Increasing Ag content decreased the initial thickness of interfacial IMC layer via weakening the atom affinity of Sn and Cu, while forming more Ag 3 Sn strengthening phases. Doping graphene nanosheets further inhibited the growth of initial interfacial IMC layer and controlled the morphologies, number, and sizes of Ag 3 Sn phase during soldering and thermal cycling. As a result, they synergistically led to the delayed growth of interfacial IMC layer as well as matrix microstructure after thermal cycling, thus contributing to a slower decrease rate in shear strength. Theoretical calculation also showed a synergism contribution of graphene nanosheets and Ag 3 Sn phase, with the largest decrease ratio (19.8%) occurred in the average interfacial diffusion coefficient in Sn–1Ag–Cu.

Improving Shear Strength of Sn-3.0Ag-0.5Cu/Cu Joints and Suppressing Intermetallic Compounds Layer Growth by Adding Graphene Nanosheets

Unravelling the synergistic enhancement effect of Ag3Sn phase and graphene nanosheets addition on the thermal cycling reliability of Sn–xAg–0.7Cu solder joint

Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints

Effect of Nano-Cu6Sn5 Upon Development Mechanism of Cu–Ni–Sn Compounds and Mechanical Characteristics for Mixed Solder Joints

Effect of Nano-Cu 6 Sn 5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

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Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints

Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints

Suppression Effect of Cu and Ag on Cu 3 Sn Layer in Solder Joints

Sn–3.0Ag–0.5Cu Nanocomposite Solders Reinforced by Graphene Nanosheets

Microstructure evolution and mechanical properties of Sn-3.5Ag-1.0Zn/Cu joint

Properties and Microstructure Evolution of Sn–Cu–Ni/Cu Joints Bearing Carbon Nanotubes and Graphene Nanosheets for Solar Cell

Intermetallic compound evolution and mechanical properties of Cu/Sn58Bi/Cu 3D structures blended with B 4 C nanoparticles during isothermal aging

Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging

Investigation of Isothermal Aged Sn-3Ag-0.5Cu/Sn58Bi-Co Hybrid Solder Joints on ENIG and ENEPIG Substrate with Various Mechanical Performances

Interfacial Reactions and Microstructural Evolution of BGA Structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu Mixed Assembly Joints During Isothermal Aging

Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder