Abstract:<p>In this study, the effects of factors such as temperature, solution and surface roughness on the growth of whiskers in a 100 μm thick Sn-Al alloy coating were comparatively investigated under different environments. The results indicated that whiskers did not grow after nucleation at 30 °C in oil. With the increase in aging temperature, whiskers started to grow after nucleation. The morphologies of whiskers showed the filament-type at 50 °C and the hillock-type at 100 °C. The residual compressive stress in the coating gradually decreased with the growth of whiskers and hillocks. Whisker nucleation was not found on the coating kept in water solution. The residual stress in the coating was rapidly released through the micro-cracks at the coating/substrate interface instead of growing whiskers. The oxide layer on the coatings with rough surfaces was easier to crack due to the higher thermal stress. The thermal stress on the oxide layer was in directly proportional to the depth of indentation and inversely proportional to the grain size. Whiskers preferentially grew on the (001)-oriented Sn grains in the coating. The finite element simulation results indicated that the grains with <em>c</em>-axis perpendicular to the coating surface had higher thermal strain and tended to grow whiskers. During creep deformation, the stress exponent increased from 7.0 to 11.5 with the increase in temperature. The mechanism for whisker growth was dislocation slip. Grain boundaries were observed in the hillocks. The power-law breakdown was the mechanism for the growth of hillocks.</p>

Modeling of Growth Rate and Morphology Mechanism of Whisker and Hillock on Micro-Bumps under Temperature-Pressure-humidity Storage

Growth Behavior of Tin Whisker and Hillock on Cu/Ni/SnAg Micro-Bumps under High Temperature and Humidity Storage

Growth Behavior of Tin Whisker on SnAg Microbump under Compressive Stress

Growth Behavior and Mechanism of Tin Whisker on Isolated SnAg Solder under Compressive Stress

The Influence of Non-Uniform Copper Oxide Layer on Tin Whisker Growth and Tin Whisker Growth Behavior in SnAg Microbumps with Small Diameter

Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging

Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills

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Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling

Inhibition of Tin Whisker by Electroplating Ultra-Thin Co-W Amorphous Barrier Layer

Internal Microstructure Investigation of Tin Whisker Growth Using FIB Technology

Growth evolution and formation mechanism of η′-Cu6Sn5 whiskers on η-Cu6Sn5 intermetallics during room-temperature ageing

Whisker Nucleation by Slip-Assisted Grain Rotation During Thermal Cycling

Interaction Effects Between the Preferred Growth of Β-Sn Grains and Thermo-Mechanical Response in Microbump Interconnects under Thermal Cycling

Tin Whisker Growth on Electroplated Sn Multilayers

Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling

Mechanistic Insights into Single Crystal Cadmium Whisker Growth on Ti 2 Cd Intermetallic

Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers

A comparative study on the growth behaviors of Sn whiskers and hillocks in a Sn-Al alloy coating under different environments

The Effect of Coating Thickness and External Force on the Growth of Tin Whisker

Atomic migration of Cu-pillar bumps in thermomechanical coupling fields