Abstract:The investigation of the electrical, mechanical, and chemical properties of atomic gold wires and the nanopoint contacts connecting two metallic surfaces with a view to developing molecular electronic devices based on nanoscale metallic wires is an increasingly popular field of research.[1–6] An intriguing possibility is to use mechanical energy as a tool to construct such nanoscale architectures. For example, suspended monoatomic gold nanowires[7–9] have been detected by using mechanically controllable break junctions or atomic force microscopy. Recent theoretical work has focused on the modulation of mechanical and electrical conduction properties of such nanowires bridging two gold surfaces by the inclusion of defects, such as sulfur atoms and thiolate molecules.[10,11] However, the role of these defects in the formation and growth, as well as their implications for the isomerization chemistry, of these wires remains an open issue. We recently reported ab initio molecular-dynamics simulations that, surprisingly, also lead to such a nanowire.[12] In this simulation a single chemisorbed thiolate molecule was pulled from a gold surface, a situation akin to corresponding experiments.[13] Thus, these simulations suggest that a single thiolate molecule may be used as a moleculer “hook” which allows the controllable extraction of monoatomic gold nanowires from bulk metallic surfaces. However, for this effect to be of practical importance it must be transferable to other nanoscale materials, such as gold nanoparticles deposited or grown on semiconducting substrates.[2,14] Relevant to this discussion is the observation[12] that the pulling process resulted first in the temporary formation of a “localized gold cluster” which was initially pulled from the surface along with the thiolate. This situation suggests that the underlying mechanism for drawing monoatomic gold wires may be the reorganization of the metal–metal bonds within the goldcluster “intermediates” and would suggest that the process is transferable to interfaces other then those involving flat surfaces. In principle, this could open up possibilities for “mechanochemical wiring” of hybrid molecular–metallic nanostructures at will. Is it easy to estimate if the above-mentioned processes might be possible on small clusters instead of surfaces? The bonding of thiolates to gold clusters offers a wide variety of structures including some in which there are fewer, but stronger, Au S bonds than found with bulk surfaces.[15, 16] In addition to the coordination-number issue there are also energetic considerations which are more difficult to judge. Typical thiolate–gold-cluster binding energies (from gradient corrected density functional calculations) are in the range 2.5–3 eV,[15] which is between the Au Au bond energy in Au2 (about 2.3 eV) and the cohesive energy of the face-centeredcubic (f.c.c.) solid (approximately 3.8 eV). Furthermore, the chemisorption energy on bulk terminated surfaces is of the order of 1.5–1.8 eV[16] depending on the method used and the binding site. Still, it is possible to draw nanowires from surfaces because the decrease in coordination number occurs in conjunction with dynamic restructuring.[12] Thus, simple estimates do not lead to a faithful assessment, so we performed electronic-structure calculations based upon Kohn–Sham density functional theory.[17] To mimic a typical mechanical pulling experiment involving a molecule attached to a supported cluster we have used Au3 SCH3 and Au5 SCH3. Such small species represent limiting cases of molecular bonding in which the few Au S and Au Au bonds present are strong. Thus, these lowcoordination cases are very different from the situation encountered at extended surfaces. The following constrained geometry relaxation model was applied (Figure 1, see refs. [18,19] for related approaches): one gold atom was constrained to move in a plane P1 whereas the methyl carbon

One-dimensional Metallic Grain Boundary in Transition Metal Dichalcogenides

Inclination-governed Deformation of Dislocation-Type Grain Boundaries

Functional Grain Boundaries in Two-Dimensional Transition-Metal Dichalcogenides

Grain Boundary Dominated Plasticity in Metallic Materials

Grain Boundaries in Chemical-Vapor-deposited Atomically Thin Hexagonal Boron Nitride

Intrinsic Magnetism of Grain Boundaries in Two-dimensional Metal Dichalcogenides

Formation mechanism of mirror twin grain boundaries in molecular beam epitaxy grown monolayer WSe2-MoSe2 lateral heterojunctions

Retrieving Grain Boundaries in 2D Materials

Grain Boundary and Misorientation Angle-Dependent Thermal Transport in Single-Layer MoS2.

Visualization of Confined Electrons at Grain Boundaries in a Monolayer Charge‐Density‐Wave Metal

Decoding Grain Boundary Thermodynamics in High-Entropy Alloys in a 5D Space: Coupled Segregation and Disordering

Polymorphism of Segmented Grain Boundaries in Two-Dimensional Transition Metal Dichalcogenides

Observing Grain Boundaries in CVD-grown Monolayer Transition Metal Dichalcogenides.

Ferroelectric Domain Switching Pathways—from Grain Boundary to Grain Body

1D metallic states at 2D transition metal dichalcogenide semiconductor heterojunctions

Thermal structural disorder and melting transition in high-angle grain-boundary: a molecular-dynamics study

Towards "mechanochemistry": mechanically induced isomerizations of thiolate-gold clusters.

Topological grain boundary segregation transitions

Misorientation-angle-dependent Electrical Transport Across Molybdenum Disulfide Grain Boundaries

Well-Hidden Grain Boundary in the Monolayer MoS2 Formed by a Two-Dimensional Core-Shell Growth Mode

Remarkably High Thermal-Driven MoS2grain Boundary Migration Mobility and Its Implications on Defect Healing