Assembly Strategy and Performance Evaluation of Flexible Thermoelectric Devices
Dawei Qu,Xin Li,Hanfu Wang,Guangming Chen
DOI: https://doi.org/10.1002/advs.201900584
IF: 15.1
2019-05-22
Advanced Science
Abstract:<p>Although organic and composite thermoelectric (TE) materials have witnessed explosive developments in the past five years, the research of flexible TE devices is rather limited. In particular, their assembly strategies and device performance reported in the literature cannot be directly compared, due to a variety of deviances including p‐ and n‐type component materials, shape and dimensions of p‐n flexible films, and applied temperature gradient (Δ<i>T</i>). Here, three types of assembly strategies for flexible TE devices, that is, serial, folding, and stacking, are compared by fixing the corresponding experimental parameters. Furthermore, a convenient and general method to evaluate the flexible device performance (FDP) is put forward, that is, <math>FDP = PmaxmΔTN</math>, where the maximum output power (<i>P</i><sub>max</sub>) is divided by product mass (<i>m</i>), Δ<i>T</i>, and pair number of p‐n couples (<i>N</i>). The FDPs for the present serial, folding, and stacking devices are 11.13, 8.87, and 0.05 nW g<sup>−1</sup> K<sup>−1</sup>, respectively, confirming that the serial configuration is the best among the three strategies for flexible device fabrication. The preliminary evaluation method proposed herein will pave the way for a design strategy of flexible TE devices and speed up their applications in waste‐heat harvesting, e‐skin, wearable electronics, etc.</p>
materials science, multidisciplinary,nanoscience & nanotechnology,chemistry