Abstract:Among ceramic matrix composites (CMCs), carbon fiber-reinforced silicon carbide matrix (C/SiC) composites are widely used in numerous high-temperature structural applications because of their superior properties. The fiber-matrix (FM) interface is a decisive constituent to ensure material integrity and efficient crack deflection. Therefore, there is a critical need to study the mechanical properties of the FM interface in applications of C/SiC composites. In this study, tensile tests were conducted to evaluate the interfacial debonding stress on unidirectional C/SiC composites with fibers oriented perpendicularly to the loading direction in order to perfectly open the interfaces. The characteristics of the material damage behaviors in the tensile tests were successfully detected and distinguished using the acoustic emission (AE) technique. The relationships between the damage behaviors and features of AE signals were investigated. The results showed that there were obviously three damage stages, including the initiation and growth of cracks, FM interfacial debonding, and large-scale development and bridging of cracks, which finally resulted in material failure in the transverse tensile tests of unidirectional C/SiC composites. The frequency components distributed around 92.5 kHz were dominated by matrix damage and failure, and the high-frequency components distributed around 175.5 kHz were dominated by FM interfacial debonding. Based on the stress and strain versus time curves, the average interfacial debonding stress of the unidirectional C/SiC composites was approximately 1.91 MPa. Furthermore, scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDXS) were used to observe the morphologies and analyze the chemical compositions of the fractured surfaces. The results confirmed that the fiber was completely debonded from a matrix on the fractured surface. The damage behaviors of the C/SiC composites were mainly the syntheses of matrix cracking, fiber breakage, and FM interfacial debonding.

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