Adaptable Morphing-Enabled Active Cooling Flexible Heat Sink with High Thermal Conductivity
Guidong Chi,Dehai Yu,Quan Zhou,Xiangfei Wang,Mingyuan Wang,Chuanke Liu,Maolin Li,Zhonghao Wang,Zhizhu He
DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2024.126265
IF: 5.2
2025-01-01
International Journal of Heat and Mass Transfer
Abstract:Flexible heat sink has a wide application prospect in electronics and power systems for thermal management due to its outstanding interface mechanical compliance matching. However, its low thermal conductivity and passive deformation-induced poor adaptation would seriously limit the cooling performance. Herein, we report a versatile method of fabricating grid-shaped liquid metal (LM) matrix-embedded elastomer (LME) using 3D printing- dissolvable mold method to improve heat conduction. The thermal-mechanical properties (deformation, thermal conductivity and fluid-thermal transfer) are analyzed by the numerical model in this work, and verified by the experiment results. The LME can achieve a near-identical thermal conductivity in tensile (24.6 W/mK) and thickness (25.8 W/mK) direction for the 80% LM filling volume ratio under 300% strain. Based on this, we develop the LME-active cooled sleeve (LME-ACS) with its hydraulic-driven conformal morphing strategy. The thermal properties of LME-ACS are closely related to its mechanical performance. The LME-ACS can be morphed by modulating the load pressure of the channels to conform to the complicated shape (e.g. clovers) tightly, minimizing contact thermal resistance between interfaces. The inner wall thickness of the LME-ACS can be reduced from 2 mm to 0.57 mm by stretching the inner diameter of LME-ACS and increasing the load pressure within the channels. The cooling performance of LME-ACS can be improved significantly with the increasing inner diameter (Delta T Delta T = 26.9 degrees C between 60 mm and 80 mm at 5280 W). This work provides a novel approach to fabricate high-performance LM-based elastomer and may further advance the applications in various areas, such as thermal management systems, flexible electronics and soft robotics.