Abstract:With the continuous increase of the output power of semiconductor laser array, the heat generation in the active region also increases continuously, which influences the performances and lifetime of semiconductor laser array seriously. In order to improve the performances and lifetime, understanding of the thermal behavior of high power semiconductor laser array packages and optimizing the thermal performance are crucial. By means of numerical analysis, a three-dimensional thermal model has been established, and the static and transient thermal characteristics in continuous-wave (CW) and quasi-continuous-wave (QCW) modes also have been studied systematically for a hard solder, conduction-cooled-packaged 808nm semiconductor laser array. Based on the thermal modeling and analysis, the approaches to reduce thermal resistance have been proposed. The results show that: compared with copper-tungsten (CuW), adopting the copper-diamond composite material as the submount can decrease the thermal crosstalk behavior between emitters, and reduce the thermal resistance by about 30%. In addition, a novel thermal design for the packaging structure of the mounting heat-sink is demonstrated, which has the ability of reducing the thermal resistance of the devices significantly.

Research on Thermal Characteristics of Tapered Laser Chip

Theoretical Analysis of Thermal-Lensing Effect in a High Power Exciplex Pumped Cs Vapor Laser.

Research on Failure Mechanism of 976nm Tapered Laser

Analysis of thermal spreading resistance in high power LED package and its design optimization

The Research on the Edge Thermal Effect of the Thin Disk Crystal in Thin Disk Lasers

Simulation Study on Thermal Characteristics and Thermal Stress of Semiconductor Laser Package

Thermal Modeling and Analysis of High Power Semiconductor Laser Arrays

Thermal Characteristic Simulation and Analysis of Semiconductor Laser Based on C-mount

Investigation of the gain match in high brightness 980 nm tapered diode laser

Finite Element Thermal Analysis of Optical Elements in a Laser Incoherent Space Beam Combiner

Numerical simulation of thermo-mechanical behavior in high power diode laser arrays

Investigation of Thermomechanical Stress Characteristics in High-Power 808-Nm AlGaAs/GaAs Laser Diode Bars

Residual Thermal Stress of a Mounted KDP Crystal after Cooling and Its Effects on Second Harmonic Generation of a High-Average-power Laser

Thermal Analysis of a Novel Compact Packaged Passively Cooled Laser Diode Array

Thermal design for the package of high-power single-emitter laser diodes

Analytical investigation on transient thermal effects in pulse end-pumped short-length fiber laser.

Numerical Simulation and Experimental Research on Reduction of Taper and HAZ During Laser Drilling Using Moving Focal Point

Simulation on Thermal Characteristics of LED Chips for Design Optimization

Analysis of Thermal Effects in A Pulsed Laser Diode End Pumped Single-Ended Composite Tm:Yag Laser

Study on Thermal-Mechanical Impact Effects on Parabolic Laser Thrusters

Enhanced heat transfer characteristics using dimples in the receiving end of laser wireless power transmission system