Real Time Process Monitoring Using Diffraction-Based Overlay Measurements from YieldStar

Henry Chen,Jimmy Chang,Sheng-Tsung Tsao,Junjun Zhang,Jie Du,Congcong Fan,Alex Huang,David Xu,Sam Liu,Liang Wu,Kimi Yang,Ning Gu,Liping Ren,Jian Wu,Alexander Tan,Sunny Xia,Ivan Mao
DOI: https://doi.org/10.1109/iwaps51164.2020.9286803
2020-01-01
Abstract:Real-time process monitoring (RTPM) is a method for semiconductor manufacturing monitoring and tuning using a physical prediction model. It is a fast and nondestructive process excursion measurement method which takes inputs from diffraction-based overlay measurements from YieldStar. The prediction model is created by a physical model which receives standard manufacturing information as input. The prediction capability has been validated in a manufacturing environment experiment with thin film thickness prediction difference less than 3%.
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