Abstract:Benzocyclobutene (BCB) resin has been widely used as an advanced electronic packaging material due to its excellent low-dielectric (low-k) properties, good thermal stability, and high planarization. However, it is still urgent to further reduce its dielectric constant for high-frequency applications. Herein, a series of organoalkoxysilane (D 4 Si n )-functionalized thermosetting benzocyclobutene (BCB) resins were reported. Precursors with the large hindrance of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane (D 4 Vi ) ring as the core, as well as tunable vinyl and methoxyl substituents as pendant groups, have been successfully prepared by the efficient platinum-catalyzed hydrosilylation reaction. They can further undergo the pre-polymerization via hydrolytic condensation of methoxyl groups and post-thermal curing processes via thermal-induced ring-opening and Diel-Alder reactions between vinyl groups and bis (benzocyclobutenyl) divinyltetramethylsiloxane (DVS-BCB), respectively. The fully cured materials exhibited excellent dielectric properties with a dielectric constant ( D k ) of 2.20 and a dissipation factor ( D f ) of 7.04 × 10 −4 , good thermal stability (the 5% weight loss temperature, T d5 ˃ 445 °C), strong hydrophobicity (water contact angle >100°) and good mechanical properties. Compared with traditional thermosetting BCB resins, this procedure combined BCB resins with silsesquioxanes including the ladder/cage-like or network topological structures. This work provided a simple and universal method to construct intrinsically porous materials of organoalkoxysilane-functionalized BCB resins, laying the foundation for the future fabrication of ultra-low dielectric electronic packaging materials with nanoscale pores.

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