Effect of time and spatial domains on monolayer 2D material interface thermal conductance measurement using ns ET-Raman

Nicholas Hunter,Hamidreza Zobeiri,Tianyu Wang,Xinwei Wang
DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2021.121644
IF: 5.2
2021-01-01
International Journal of Heat and Mass Transfer
Abstract:Raman-based approaches to characterizing thermal properties of nanoscale and microscale materials have proven to be powerful experimental methods. This work explores the potential of energy-transport state resolved Raman (ET-Raman) for the precise determination of interfacial thermal conductance ( G ) between monolayer 2D materials and their substrates. ET-Raman employs a continuous wave laser and nanosecond (ns) pulsed laser to induce both steady state and transient heating while simultaneously collecting 2D material temperature information from the Raman signal. A 3D numerical model built using the finite volume method simulates the two differentiated thermal transport processes. The simulated temperature rises are compared with experimental Raman temperature information to extract G . In this study, we investigate the temporal effects of the pulse frequency and pulse width of the ns laser on precise characterization of G . By running multiple simulations for a range of pulsed laser frequencies and pulse widths, we determine that ET-Raman is most sensitive to precise interfacial thermal conductance measurements with short pulse widths (similar to below 20 ns) and with pulsing frequencies that ensure sufficient cooling time between consecutive pulses (similar to below 500 kHz). We also conclude that substrate thickness and laser spot size play critical roles in heat distribution and subsequent sensitivity to meaningful G measurements. As both laser spot size and SiO2 substrate thickness decrease, detection of interfacial thermal transport becomes more difficult. These results offer essential guidance in the design of future Raman-based approaches to thermal measurements using pulsed lasers. (c) 2021 Elsevier Ltd. All rights reserved.
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