Abstract:Board-level solder joint reliability is very critical for handheld electronic products during drop impact. In this study, board-level drop test and finite element method (FEM) are adopted to investigate failure modes and failure mechanisms of lead-free solder joint under drop impact. In order to make all ball grid array (BGA) packages on the same test board subject to the uniform stress and strain level during drop impact, a test board in round shape is designed to conduct drop tests. During these drop tests, the round printed circuit board assembly (PCBA) is suffered from a specified half-sine acceleration pulse. The dynamic responses of the PCBA under drop impact loading are measured by strain gauges and accelerometers. Locations of the failed solder joints and failure modes are examined by the dye penetration test and cross section test. While in simulation, FEM in ABAQUS software is used to study transient dynamic responses. The peeling stress which is considered as the dominant factor affecting the solder joint reliability is used to identify location of the failed solder joints. Simulation results show very good correlation with experiment measurement in terms of acceleration response and strain histories in actual drop test. Solder joint failure mechanisms are analyzed based on observation of cross section of packages and dye and pry as well. Crack occurred at intermetallic composite (IMC) interface on the package side with some brittle features. The position of maximum peeling stress in finite element analysis (FEA) coincides with the crack position in the cross section of a failed package, which validated our FEA. The analysis approach combining experiment with simulation is helpful to understand and improve solder joint reliability.

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Study of Accelerated Shear Creep Behavior and Fracture Process of Micro-Scale Ball Grid Array (BGA) Structure Cu/Sn–3.0Ag–0.5Cu/Cu Joints under Coupled Electro-Thermo-mechanical Loads

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Creep Deformation and Fracture Behavior of Micro-Scale Cu/Sn-3.0Ag-0.5Cu/Cu Joints under Electro-Thermo-mechanical Coupled Loads

Size Effect on Creep Deformation and Fracture Behavior of Micro-Scale Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints

Creep Constitutive Relationships And Cyclic Behaviors Of Sn96.5ag3cu0.5 Under High Temperatures

Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints

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Thermal Creep and Fracture Behaviors of the Lead-Free Sn–Ag–Cu–Bi Solder Interconnections under Different Stress Levels

Effective Acquisition of Elastoplastic and Creep Parameters of Lead-Free Solder Alloy from High-Temperature Micro-Indentation Eliminating the Size Effect

Modelling of Ag3Sn coarsening and its effect on creep of Sn–Ag eutectics

Dorn Creep Model and Finite Element Simulation of SnAgCu-CNT Solder Joints in FCBGA Device

Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

Finite element method and experimental study on life prediction of lead-free BGA solder joints using an energy-based approach

Creep Behavior of Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints under Tensile Stress Coupled with DC Current Stressing

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

In-situ study of creep in Sn-3Ag-0.5Cu solder