Prospects of Thermoelectric Energy Harvesting in 3D ICs

Shi-Yun Zhou,Wee-liat Ong,Er-Ping Li
DOI: https://doi.org/10.1109/ieee-iws.2019.8804077
2019-01-01
Abstract:3D ICs integration dissipates much higher power in the form of heat than conventional ICs. In this paper, we explore an idea of harvesting this waste heat using thermoelectrics (TE). We present a complete system of a thermoelectric energy generator (TEG) with vertical and planar TE structures. The preliminary output characteristics of the planar structure and vertical structure are explored.
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