Measurement Of Meso_deformation And Singularity Analysis Of Interface Crack_tip For Polylayer Materials

Bc Liu,Xq Shi
1997-01-01
Abstract:The reverse multiplicate technique of moire interferometry is introducted. In tills method,shear reverse,carrier wave, multiplicate and optical Fourier processing technique are combined cleverly and applied successfully to tile moire interferometry. When tile deformed patterns of moire interferometry with carrier wave are multiplied using carrier wave frequency,tile deformed information of the specimen are multiplied successfully at same time. As a final experimental result, the moire fringes are multiplied clearly by 16 times,and measuring displacement sensitivity is increased from 0.4 mu m to 0.025 mu m. This method is applied to measure in_plane displacement fields around interlayer crack_tip of metal film/ceramic substrate under different thermal loading. From experimental displacement fields,the strain fields around interlayer crack_tip can be obtained as well. The displacement singularity of crack_tip is analyzed. Tile experimental results show that tile displacement singularity of interlayer crack_tip under thermal loading is exponential singularity related with tile material properties of the specimen.
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