An Automatic Test System for a Spaceborne Chip of a Temperature-Sensing Controller
LIU Tong,CHEN Hua,QIU Jinpeng,WANG Zhiyu,LIU Xiaomin,WANG Liping,YU Faxin
DOI: https://doi.org/10.3969/j.issn.1004-1699.2016.09.026
2016-01-01
Abstract:In order to evaluate the electrical specification,temperature sensing and single event tolerance of space?borne phased-array T/R modules,an automatic test system based on PXI bus is designed and developed. By using this test system,the evaluation of a self-developed integrated controller with temperature sensor,which is embedded in a spaceborne X-band T/R module,is performed in this paper. By using high-speed digital I/O technology,the test speed of the present test system for electrical characteristics is improved. The ability of automatic temperature test with high-precision enables the accurate performance assessment of temperature sensing. And with the ability of au?tomatic data processing,the test system can realize the comparison between the measured electrical properties and the design specifications,the error analyzation between test data and calibration temperature and the variation esti?mation before and after single event effects. Finally,power distribution,temperature sensing and single event toler?ance of the chip are tested and analyzed. The results show that the chip can be well performed in the space environ?ment with rapidly changing temperature and strong radiations. At the same time,the test system has the advantages of simple operation,well portability,high speed of testing and high precision.