Abstract:It is well-known that both Performance and reliability of present-day RF integrated circuits (RFICs & MMICs) and even Nano electronic devices cannot be completely understood or accurately predicted from electromagnetic considerations alone. For example, the performance parameters, such as S-parameters, power handling capability and breakdown thresholds of high-density nano interconnects and RF modules are often affected by heat conduction and mechanical stresses/deformations, in extreme cases leading to electro-thermo-mechanical breakdown. Under such circumstances, predictive simulations must rely on multiphysics computational approaches as opposed to electromagnetics-only methods. There exist many challenges in developing computational algorithms for rapidly and accurately analyzing electro-thermal and electro-thermo-mechanical phenomena in RF as well as nano electronic components and circuits with complex geometries and new material properties. Most material parameters involved, such as carrier mobility, permittivity, permeability, electrical conductivity, thermal conductivity, and thermal expansion coefficients are applied field, temperature, and thermal stress dependent. On the other hand, there exist significant differences in length and time scales among electrical, thermal, and mechanical field actions. Therefore, special attention must be paid to the choice of spatial discretization and time stepping procedures to ensure convergent multiphysics solutions. This talk will address challenges and opportunities in computational multiphysics method and its application for RF and Nano electronics, with a series of examples given and demonstrated for the capability of time-domain finite element method and its implementation.

Thermal Evaporation of Different Copper Nanotip Structures under High Electric Field Based on Electrodynamics – Molecular Dynamics Simulations

Molecular Dynamics Simulations of Thermal Evaporation and Critical Electric Field of Copper Nanotips

Nanotip Shape Evolution Under High Electric Fields Based on Molecular Dynamics

Structural Evolution and Thermal Runaway of Refractory W and Mo Nanotips in the Vacuum under High Electric Field from PIC-ED-MD Simulations

Molecular Dynamics Simulation of the Elastic Properties of Metal Nanowires in a Transverse Electric Field

Computational Multiphysics Method for Rf and Nano Electronics: Challenges and Opportunities

Electrodynamics - molecular dynamics simulations of the stability of Cu nanotips under high electric field

Electromagnetic–Thermo–Mechanical Coupling Behavior of Cu/Si Layered Thin Plate under Pulsed Magnetic Field

Atomic Structure Evolution and Linear Regression Fitting Models for Pre-Breakdown Electric Field Strength of FCC, BCC and HCP Metal Nano-Emitters under High Electric Field from PIC-ED–MD Simulations

MOLECULAR DYNAMICS SIMULATIONS OF NANOMA-CHINING MECHANISM AND THERMAL EFFECTS OF SINGLE CRYSTAL Cu

Exploring Thermal Interface Materials for Electronics Via Molecular Dynamics Simulations: A Review

Molecular Dynamics Simulations of Thermal Effects in Nanometric Cutting Process

Molecular dynamics simulations of nanomachining mechanism and thermal effects of single crystal Cu

Effect Of Electrode Materials On The Vacuum Breakdown Behaviors At Nanoscale

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Molecular Dynamics Simulation of the Thermal-Caused Material Removal Process by the SPM-based Electric Nanofabrication

Molecular dynamics simulations of surface modification formations on polycrystalline Cu under high electric fields

Ab-Initio Simulation of Field Evaporation

Effect of Electrode Geometry on the Vacuum Breakdown Behaviors at Nanoscale

Thermal and electric field driven breakdown precursor formation on metal surfaces

Discharge Behaviors of Electrical Breakdown Across Nanometer Vacuum Gaps