Abstract:For the high-power microwave (HPM) components applied in the space environment, the seed electrons in the components may resonate with the radio frequency electrical field and may further result in the occurrence of secondary electron multiplication, as a result, the phenomenon of multipactor may be triggered. Multipactor deteriorates the performance of the components, and in severe circumstances, it is even possible to cause the failure of the components or the spacecraft. Alumina ceramic possesses good dielectricity, high hardness, good thermal isolation, low dielectric loss, etc. so it is widely used in HPM systems including dielectric windows, and many other microwave components. However, alumina ceramic possesses a relatively high level of secondary electron yield (SEY or δ ), which indicated that the devastating effect of multipactor discharge is likely to be triggered inside the alumina-filled HPM components in the space environment. In this work,the model of alumina loaded coaxil low pass fillter was simulated to verify that reducing the SEY of the alumina surface to pursue an improvement in the multipactor threshold is effective and necessary. After that, we applied several technologies to achieve an ultralow SEY on the alumina surface. Firstly, a series of microstructures with different porosity and aspect ratio were fabricated. The results indicate that the microstructure with 67.24% porosity and 1.57 aspect ratio showed an excellent low-SEY property, which is able to suppress the SEY peak value ( δ m ) of alumina from 2.46 to 1.10. Then, various process parameters were applied to fabricate TiN films on silicon sheets. Experimental results indicate that the TiN film achieves the lowest δ m of 1.19 when the gas flow ratio of N 2 :Ar is 7.5:15. Thereafter, we deposited TiN ceramic coating onto the laser-etched microstructure samples, and an ultralow δ m of 0.79 was finally achieved on alumina surface. Then we implemented a qualitative analysis to explore the influence of surface charge on the secondary electron emission and multipactor for the microstructured alumina surface, as well as, the mechanism of low-SEY surfaces mitigating unilateral and bilateral multipactor was discussed. For verifying the actual effect of low-SEY technologies on the suppression of multipactor, we applied the technologies of constructing microstructure and depositing TiN films on the alumina surface, which is filled in the designed coaxial low pass filter. Finally, we obtained a significant improvement in the multipactor threshold for the filter, which increases from 125 W to 650 W, and the improvement is 7.16 dB. This work develops an effective method to reduce SEY for alumina, which makes great scientific sense for revealing the mechanism of multipactor for the dielectric-filled microwave components and is of engineering application significance for improving the reliability of HPM components.

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