Abstract:A comparison of classical percolation with interparticle interaction based structural changes in composite materials. Stretchable electronic conductors are vital components in soft robotics and flexible electronics. One method for producing these is combining conductive filler with a nonconductive elastomer. These composites commonly exhibit significant piezoresistivity. This work examines various mechanisms that may underlie this effect. These composites are generally analyzed through percolation theory, which describes the nonlinear relationship between filler volume fraction and conductivity. However, it is unclear whether percolation theory can explain their piezoresistivity or whether mechanisms such as rearrangement of the conductive network under deformation must be considered. This work compares volumetric change in the context of percolation theory against network rearrangement to examine the relative significance of these factors in determining piezoresistivity. Digital image correlation is utilized to investigate volumetric changes in carbon‐black silicone composites and finds that the typical assumption of incompressibility is reasonable, suggesting that volumetric changes alone cannot account for the behavior. A computational model is also developed, which implies that network rearrangement is likely a more significant factor and that interparticle interactions are crucial in understanding this effect. It was found that the most realistic modeling results were achieved only when both rigid and attractive interparticle interactions were accounted for in the model.

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