Abstract:Hybrid 3D printed rigidity‐programmable substrate/liquid metal 3D circuits are used to develop a stretchable pulse sensor, which effectively mitigates the rigid‐flexible mismatch challenge in stretchable electronics and streamlines circuit design. Stretchable electronics have the unique capability of 3D (three dimensional) deformation, overcoming the brittleness of traditional inorganic electronics. However, during large deformations, different scale strains between the rigid and stretchable components lead to mismatch, causing interconnect failures. Therefore, the development of the rigidity‐programmable substrate with effective strain shielding capabilities has become a research hotspot. Furthermore, the exponential growth in electronic density presents challenges in the circuit design of stretchable electronics. The urgent need is to develop highly integrated stretchable electronic systems. In this study, a highly integrated stretchable pulse sensor with effective strain shielding capabilities using hybrid 3D printing technology is developed, which comprises electronic chips, a rigidity‐programmable substrate/encapsulation layer printed by using PSC (polydimethylsiloxane/silica‐nanoparticles composite)‐based ink, and LM (liquid metal)‐based 3D circuits. First, the PSC‐based ink is optimized to enhance the strain shielding effectiveness of the rigidity‐programmable substrate. Meanwhile, 3D printing parameters are optimized to achieve high printing precision with minimum line widths below 100 μm. The resulting stretchable pulse sensor demonstrated good mechanical and electrical stability under complex 3D deformations, including bending, twisting, and stretching. The PSC region strain of the sensor is only ≈2% when the global strain is up to ≈65%, which exhibited effective strain shielding capabilities.

Direct Fabrication of Stretchable Electronics on a Programmable Stiffness Substrate with 100% Strain Isolation

Direct Fabrication of Stretchable Electronics on a Polymer Substrate with Process‐Integrated Programmable Rigidity

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Highly Elastic Polymer Substrates with Local Strain Management for Stretchable Electronic Applications

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Fabric-based stretchable electronics with mechanically optimized designs and prestrained composite substrates

Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Monolithically Integrated Stretchable Photonics

Strain-Limiting Substrates Based on Nonbuckling, Prestrain-Free Mechanics for Robust Stretchable Electronics

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

A High Stretchability Micro-Crack Tactile Sensor System Based on Strain-Isolation Substrate

Mechanics of stretchable inorganic electronic materials

Localized modulus-controlled PDMS substrate for 2D and 3D stretchable electronics

Elastomers with Microislands as Strain Isolating Substrates for Stretchable Electronics

A Strain-Isolation Design for Stretchable Electronics

Stiffness and Interface Engineered Soft Electronics with Large-Scale Robust Deformability

Hybrid Printed Rigidity‐Programmable Substrate/Liquid Metal 3D Circuits Toward Stretchable Electronics

Design strategy of porous elastomer substrate and encapsulation for inorganic stretchable electronics