Abstract:Voltage contrast (VC) has been a powerful tool for the failure analysis of integrated circuits and multichip module. As the packing density of printed circuit board (PCB) is increasing, conventional failure analysis methods to detect open or short circuit in PCBs are no longer adequate, and voltage contrast method could be a method for this purpose. However, unlike the cases of integrated circuits and multichip module, there are many areas in PCB that will produce serious charging effect when examine under the scanning electron microscope. One of the areas is the presence of solder mask on PCB.This work examines the feasibility of using voltage contrast for PCB failure analysis. Specially designed PCB is used for experimentation, and it is found that positive bias on one track and zero bias on another copper track provide a better image contrast as compared to negative and zero biases on the tracks. Also, the variation of the image contrast with different spacing between inter copper tracks has studied. It is found that the variation depends on the presence of solder mask and its location. The variation can be very different for negative bias case as compared to the positive bias case.Finite element analysis is also performed to explain the experimental observations. All the observations can be well explained by the charging effect of the solder masks. The charging effect of solder mask is indeed very significant in affecting the image contrast, and it could reduce the contrast to almost zero in some cases. (c) 2005 Elsevier Ltd. All rights reserved.

Applying FSV to the Comparison of Return Path Integrity in High Speed Circuit Designs

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

Analysis of Signal Propagation in High-Speed Differential Signal Lines with Full-Wave Time-Domain Technique

Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique

Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

Analysis of reflection in high-speed digital design

Parallelized Computational Technique for Signal Propagation Analysis at Very High Speed Differential Transmission Lines

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

SIGNAL PROPAGATION IN HIGH SPEED DIFFERENTIAL TRANSMISSION LINE USING PARALLELIZED FINITE-DIFFERENCE TIME-DOMAIN METHOD

Comparison Of Two Compact 2d-Fdfd Methods And Their Application To Extraction Of Circuit Parameters

Feasibility Study of the Application of Voltage Contrast to Printed Circuit Board

A Coupled Efficient and Systematic Full-Wave Time-Domain Macromodeling and Circuit Simulation Method for Signal Integrity Analysis of High-Speed Interconnects

Crosstalk analysis in frequency and time domain using FDTD-VF method

Performance Improvement Of Fsv In A Special Situation

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

Analysis of Signal Propagation on High‐speed Planar Interconnect Systems Based on Full‐wave and Macromodeling Techniques

Far-End Crosstalk Mitigation for Microstrip Lines in High-Speed PCBs

Improvement in the Definition of ODM for FSV

Research on Signal Integrity in High-Speed Interconnection Channel Based on SIwave