Abstract:Heat pumping through thermoelectric devices has many advantages over traditional cooling. However, their current efficiency is a limiting factor in their implementation. In this paper, we approach the non-convex topology optimization of thermoelectrical elements for cooling applications through the method of moving asymptotes (MMA) to improve their cooling capabilities per watt usage. The optimization problem is defined for a given power budget, aiming for the minimum temperature with a known heat pumping need. The introduction of power as a constraint justifies the introduction of the voltage gradient across the thermocouple as a design variable to maintain the thermoelectrical device in its optimum power-to-heat extraction ratio. To better understand the convergence of this non-convex problem, we present a two-variable analytical thermoelectric optimization model. This example provides information on how to select the penalty parameters used to scale the three material coefficients involved in the problem to obtain lower objective values and better convergence using MMA. The analytical model shows the non-convexity of the problem and provides the recommendation to use penalization coefficients of the form for the thermal conductivity, electrical conductivity, and Seebeck coefficients. We tested these penalization coefficients through optimizations of a model based on the 1MC10-031 commercial thermoelectric-cooler (TEC) using the finite element method (FEM). These penalization coefficients provided local minima without the need for volume constraints. With this procedure, we found designs that provided temperatures close to 10 degrees lower using 60% less semiconductor material volume compared to the initial design.

Optimizing the Geometric Structure of a Thermoelectric Cooler with Multi-objective Constraint

Design Optimization of Thermoelectric Cooling Systems for Applications in Electronic Devices

Optimization of heat sink of thermoelectric cooler using entropy generation analysis

Optimization of A Trapezoid-Type Two-Stage Peltier Couples for Thermoelectric Cooling Applications

Proposing a procedure for multi-objective optimization of cascade thermoelectric coolers to achieve maximum cooling capacity and COP

Multi-parameters Analysis and Optimization of a Typical Thermoelectric Cooler Based on the Dimensional Analysis and Experimental Validation

Thermal management of a flexible controlled thermoelectric energy conversion-utilization system using a multi-objective optimization

Investigation of the impact of the thermoelectric geometry on the cooling performance and thermal—mechanic characteristics in a thermoelectric cooler

Simultaneous optimization of cooling temperature difference and efficiency for multi-stage thermoelectric device

Enhancing the cooling performance of thermocouples: a power-constrained topology optimization procedure

Optimum allocation of heat transfer surface area for cooling load and COP optimization of a thermoelectric refrigerator

Individualization of optimal operation currents for promoting multi-stage thermoelectric cooling

Analysis on optimal heat exchanger size of thermoelectric cooler for electronic cooling applications

Optimal Flow Layout and Current Allocation for Improving the Thermoelectric Refrigeration System Based on Heat Current Method

Multiparameter optimization of the thermoelectric module under the constant heat flux condition

Real-time optimization of thermoelectric coolers' performance based on energy and exergy analysis

A novel super-cooling enhancement method for a two-stage thermoelectric cooler using integrated triangular-square current pulses

A system level optimization of on-chip thermoelectric cooling via Taguchi-Grey method

Multi-objective optimization of precooled JT cryocooler working at liquid hydrogen temperature

A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

Heat Spreading Effect on the Optimal Geometries of Cooling Structures in A Manifold Heat Sink