Abstract:In order to investigate the effects of alloying Cu substrate on microstructure and coarsening behavior of Cu 6 Sn 5 grains of soldered joints, in the paper, four types of wetting layers (Cu, Cu–8 wt% Zn, Cu–15 wt% Zn and Cu–30 wt% Zn) reaction with Sn–3.0Ag–0.5Cu (SAC305) solder were fabricated. The effects of reflowing and isothermal aging on the interface of soldered joints and the morphology of Cu 6 Sn 5 grains were studied. Experimental results show that the scallop-shaped Cu 6 Sn 5 formed at the interface of SAC/Cu after reflowing. After isothermal aging for 120 h, a bi-layer structure of Cu 6 Sn 5 and Cu 3 Sn formed at the interface of SAC/Cu and some Ag 3 Sn grains decorated in Cu 6 Sn 5 , and Kirkendall voids were observed inside the Cu 3 Sn layer after aging for 240 h. However, Cu 6 Sn 5 was the predominant reaction product and Cu 3 Sn and Kirkendall voids were not observed at the interface of SAC/Cu–Zn irrespective of aging time. The thickness of IMC layer increases with increasing aging time. Compared to SAC/Cu, the additions of Zn can effectively suppress the growth of IMC. During the aging process, the growth rate constants of IMC layers of SAC/Cu, SAC/Cu–8Zn, SAC/Cu–15Zn and SAC/Cu–30Zn were obtained by using fitting method from the experimental data, which were 7.78 × 10 −17 , 5.42 × 10 −17 , 2.51 × 10 −17 and 1.46 × 10 −17 m 2 s −1 , respectively. The mean diameter of IMC grains increases with the increasing aging time. The relationships of the mean diameter of Cu 6 Sn 5 grains of SAC/Cu, SAC/Cu–8Zn, SAC/Cu–15Zn, SAC/Cu–30Zn interface joints and aging time were given, i.e., d = 1.49 t 0.237 , d = 1.46 t 0.204 , d = 1.43 t 0.203 and d = 1.71 t 0.197 , respectively.

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