Optimization Research on the Process of Gold Pulse Plating through Orthogonal Test

Nan CHEN,Ying XIONG,Liang GUO,Yangchao TIAN,Gang LIU
DOI: https://doi.org/10.3969/j.issn.1003-5311.2016.09.003
2016-01-01
Abstract:During high aspect ratio micro and nanostructures fabrication processes,the gold plating is a key process to ensure the structures have certain function.In order to meet the special characteristic of micro and nano components,high-quality gold coatings with finer-grained need to be gotten.The process of plating based on gold potassium citrate is studied. Orthogonal test is used to obtain the preferred parameters in the pulse plating process.Gold coating appearance,deposition rate and surface morphology are measured and analyzed.The effects of pulse frequency,pulse occupy and pulse current den-sity on gold coatings property and deposition rate were studied,and the optimum pulse plating parameters are:the average current density 1.8 A/dm2 ,pulse occupy 20%,and pulse frequency 6 kHz.The surface morphology of the gold coatings is observed by SEM.The results indicated that a finer-grained and good-uniformity gold deposit with good characteristics could be obtained by the optimum pulse plating parameters.Thus,the demand of micro and nanostructures metallizing process is met.
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