Preparation of high purity ultra-fine copper powder by recycling waste printed circuit board through electrochemical method

Shuhao DENG,Duoduo ZHANG,Huiqun LIU,yongmei MA
DOI: https://doi.org/10.3969/j.issn.1673-0224.2016.04.011
2016-01-01
Abstract:Ultra-fine and high purity copper powder was recycled from waste printed circuit board (PCB) by electronchemical method using SDS and Tween-80 as additives, and the optimum condition was confirmed by orthogonal design. The copper powder was characterized by means of plasma atomic emission analysis (ICP-AES), SEM, XRD and FTIR. The oxidation resistance property of copper powder was also studied. The results show that the best condition of recycling ultra-fine copper powder is as follows: by pulse electrorefining with period of 10ms and duty cycle of 0.8, in pH of 0.5 and 20℃ electrolyte, in 100 mA/cm2 current density, and with 2 g/L SDS and 2% (volume fraction) tween-80 as additives. The purity of copper powder is 99.2%, while the average particle size is about 4.9μm. The copper powders are piled up compactly with circular particles, and the average grain size is 33 nm. The oxidation resistance property of the copper powder is excellent.
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