Numerical Simulation of Recalescence During Alloy Solidification Process

LONG Wen-yuan,CAI Qi-zhou,WEI Bo-kang,CHEN Li-liang
DOI: https://doi.org/10.3321/j.issn:1001-4977.2005.11.012
2005-01-01
Abstract:The recalescence and the dendritic growth during Al-4.5%Cu binary alloy solidification processes are simulated under different cooling rates using the isothermal phase-field model, which is coupled with a heat balance which neglects temperature variations in space. The results show that the dendrite growing morphologies could be simulated realistically by using the new phase-field method; The results of simulation are agree well with the experiment; The latent heat and the cooling rate influence the dendritic growth obviously, and the recalescence of alloy solidification process is showed; Simultaneously the simulation results are agree well with the dendritic growth theory.
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