Failure Modes, Mechanisms and Effects Analysis of Single Board Computers

Xin XIA,Li-mei XIE,Zhong SHI
DOI: https://doi.org/10.3969/j.issn.1672-5468.2015.03.010
2015-01-01
Abstract:Failure Modes, Mechanisms and Effects Analysis ( FMMEA) is a kind of reliability analysis method to study the possible failure modes and failure mechanisms of each component of products, and to identify the effects of various failure modes on the components and functions of productes. The way to implement FMMEA for the Single Board Computer, including defining the system, identifying the potential failure modes, and analyzing the causes, mechanisms and effects of the failure, are introduced in detail. And the finite element analysis has been adopted to carry out the process of FMMEA for the Single Board Computer.Besides, through thermal stress analysis and vibration stress analysis, temperature distribution and vibration modes under different environment are obtained, which are the inputs of physics model of failure. And then the quantitative calculation of single point failure of the Single Board Computer is carried out by using a variety of physics of failure models. Results show that the time to failure ( TTF) of random access memory chip with SOP ( small outline package) is the shortest and the failure is due to solder joint fatigue failure caused by the temperature cycle.It is the weak point of the entire circuit board. Thus solder joint thermal fatigue failure is the main failure mechanism of the Single Board Computer. Therefore, in the implementation process of PHM for the Single Board Computer, the failure condition of this position should be monitored intensively.
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