Abstract:Using the complex image method (CIM), we have analyzed the frequency and temperature dependencies of substrate eddy currents for single-ended and differential spiral inductors on a lossy silicon substrate. From our analysis, we have derived a set of accurate closed-form expressions for calculating inductances and substrate losses due to substrate eddy currents. Here, we propose a frequency-dependent eleven-element equivalent circuit model based on these formulas. We established the validity of the model by comparing the simulated and measured results, which are in good agreement. Index Terms—Complex image method (CIM), differential inductor, eddy currents, greenhouse algorithm, inductor model. HE high operating frequencies, at which deep submicrom- eter and nano-scale CMOS devices are able to operate, have brought radio-frequency integrated circuits (RFICs) in the realm of CMOS making the quality factor of the on-chip spiral inductors a focus of intense research. The quality factor of the on-chip inductor is limited by the losses due to the finite conduc- tivity of the metal and the conducting silicon substrate. Non-per- fect metal wires used to form spiral inductors cause ohmic loss due to the non-zero resistance at low frequencies. Additionally the non-uniform current distribution in metal wires at high fre- quencies increases the losses and degrades the quality factor of inductors. This loss mechanism has been extensively studied as skin- and proximity-effect (1)-(12).

Substrate Effects of Micromachined Planar Inductor

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

Accurate Model for Micromachined Microwave Planar Spiral Inductors

Analysis of Frequency- and Temperature-Dependent Substrate Eddy Currents in On-Chip Spiral Inductors Using the Complex Image Method

Electromagnetic-Thermal Analysis for Inductances and Eddy Current Losses of On-chip Spiral Inductors on Lossy Silicon Substrate

A derived circuit model for spiral inductors on lossy silicon substrate

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Global Performance Evaluation of Various On-Chip Square Spiral Inductors on Gaas Substrates

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

Compact Equivalent Circuit Model Of Two-Layer Spiral Inductors

Q Value for Structural Optimization of Micromachined Planar Spiral Inductor

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Electrical Characteristics and Behavioral Model of Spiral Inductors On Gaas Substrate

On the Efficacy of Through-Silicon-Via Inductors

Vertical Topologies of Miniature Multispiral Stacked Inductors

A Novel Technique Fast Optimizing the Layout Parameters of Planar Spiral Inductor

A Wideband Predictive “Double-$\Pi$ ” Equivalent-Circuit Model for On-Chip Spiral Inductors

Physical Models of Planar Spiral Inductor Integrated on the High-Resistivity and Trap-Rich Silicon-on-Insulator Substrates

A physical‐based model for on‐chip double‐layer spiral inductors with a ground shield

Double-π Fully Scalable Model for On-Chip Spiral Inductors

Analysis of modeling approaches for on-chip spiral inductors