CURING KINETICS OF NANOPARTICLES/EPOXY COMPOSITES

石光,章明秋,容敏智,K.Friedrich
DOI: https://doi.org/10.3969/j.issn.1003-0999.2004.02.003
2004-01-01
Abstract:In epoxy composites filled with inorganic nanoparticles of Al 2O 3, Si 3N 4 and SiC,the surface activity of the fillers and their reactivity exert important effects on the curing process of the matrix resin. By using Fourier transform infrared spectroscopy and differential scanning calorimetry, the authors find that nano Al 2O 3, which has the strongest surface activity, remarkably accelerates the curing of epoxy, while nano Si 3N 4 with lower surface activity can only accelerate the curing at a low level and nano SiC slightly restrains the curing of epoxy.
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