Design of Wideband Top Ground MSL for Back-incidence High-speed Photodetector Packaging

Jih-Chin Chen,Bing Xiong,Enfei Chao,Changzheng Sun,Zhibiao Hao,Jian Wang,Lai Wang,Yanjun Han,Hongtao Li,Yi Luo
DOI: https://doi.org/10.1364/acpc.2020.m4a.98
2020-01-01
Abstract:Top-ground microstrip line (TGMSL) is designed for high-speed photodetector package. The fabricated TGMSL exhibits a transmission loss below 0.5 dB and a reflection coefficient less than −15 dB up to 40 GHz. © 2020 The Author(s)
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