Abstract:Thermal management materials with high thermal conductivity (TC), adjustable coefficient of thermal expansion (CTE) and excellent mechanical properties have promising applications in the electronic packaging and high-power density equipment fields. In this work, we have developed a novel strategy for tungsten-copper coated graphite flakes and aluminum nitride nanoparticles reinforced copper matrix composites (GFs(W–Cu)/AlN/Cu composites) fabricated by vacuum hot-pressing sintering. Herein, tungsten-copper coated graphite flakes (GFs(W–Cu)) were prepared by impregnation reduction and ultrasonic-assisted electroless plating, in which W–Cu coating improved interfacial bonding and realized metallurgical-physical synergy. Meanwhile, the AlN nanoparticles reinforced Cu flakes (AlN/Cu) were prepared by high energy ball milling, where AlN nanoparticles were evenly dispersed in the Cu matrix and played the role of pinning boundary and refining grain. Effects of nano-AlN with different volume fractions on the mechanical and thermal properties of GFs(W–Cu)/AlN/Cu composites were studied as well. As for the mechanical properties, the in-plane, through-plane flexural strength and tensile strength of GFs(W–Cu)/1.5AlN/Cu composite reached 276.7 ± 4.5, 390.6 ± 4.5 and 136.1 ± 3.0 MPa respectively, which increased by 96.8%, 283.7% and 120.7% than those of the GFs(W–Cu)/Cu composites. In terms of the thermal properties, the in-plane TC of GFs(W–Cu)/1.5AlN/Cu composite is 617.8 ± 12 Wm−1K−1, while the through-plane CTE ranging 25–200 °C is 4.9 ± 0.2 ppmK-1. In conclusion, the GFs(W–Cu)/AlN/Cu composites provide a huge potential for design and application in the thermal management materials.

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