Influence of Low-Temperature Annealing Temperature on the Evolution of the Microstructure and Mechanical Properties of Cu-Cr-Ti-Si Alloy Strips

Jingzhao Yang,Kun Bu,Kexing Song,Yanjun Zhou,Tao Huang,Liye Niu,Huiwen Guo,Yibo Du,Junwei Kang
DOI: https://doi.org/10.1016/j.msea.2020.140120
2020-01-01
Abstract:The changes in the yield strength and electrical conductivity of a Cu-Cr-Ti-Si alloy strip after rolling at room temperature, annealing at 370 degrees C, and annealing at 420 degrees C were investigated. The influence mechanism of the annealing temperature on the microstructure, such as the texture characteristics and dislocation density, was revealed. The results show that compared with the room-temperature rolled state, low-temperature annealing temperature has a significant effect on the mechanical properties and microstructures of the Cu-Cr-Ti-Si alloy strip. After annealing at 370 degrees C, the yield strength and ultimate tensile strength reach 525 MPa and 544 MPa, respectively. The hardness and electrical conductivity reach 164.5 HV and 84.6% IACS, respectively. In addition, the microstructure of the alloy annealing at 370 degrees C exhibits a higher dislocation density and a higher texture intensity compared to the sample rolled at room temperature. The results provide theoretical guidance for optimization of the heat treatment process of high-precision Cu-Cr-Ti-Si alloy strips.
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