Key Process Technologies for Stacked Double Si0.7Ge0.3 Channel Nanowires Fabrication

Yongliang Li,Xiaohong Cheng,Zhaoyang Zhong,Qingzhu Zhang,Guilei Wang,Yan Li,Junjie Li,Xueli Ma,Xiaolei Wang,Hong Yang,Jun Luo,Huaxiang Yin,Wenwu Wang
DOI: https://doi.org/10.1149/2162-8777/aba67a
IF: 2.2
2020-01-01
ECS Journal of Solid State Science and Technology
Abstract:In this study, key process technologies, such as epitaxy growth, fin structure etching, and selective etching of stacked Si/SiGe multilayer for the fabrication of double Si0.7Ge0.3 channel nanowires under a reasonable thermal budget are systematically investigated. A high crystal quality two-period Si0.7Ge0.3/Si stacked multilayer epitaxially grown with thin and distinct interfaces is first realized on a Si substrate. A vertical profile of the fin structure of Si0.7Ge0.3/Si stacked multilayer is achieved using HBr/O2/He plasma after fine-tuning the etching process. In addition, the highest tolerable temperature of 850 °C for the Si0.7Ge0.3/Si stacked multilayer under rapid thermal annealing is confirmed based on the crystal quality, Si0.7Ge0.3/Si interface, and Ge diffusion. Moreover, a rectangular Si0.7Ge0.3 extremity profile is realized by optimizing the concentration and temperature of tetramethyl ammonium hydroxide solution to achieve selective etching of Si to Si0.7Ge0.3 for Si0.7Ge0.3/Si stacked multilayers. Finally, a vertically stacked double Si0.7Ge0.3 nanowire structure is successfully prepared using these newly developed process technologies.
What problem does this paper attempt to address?