Dual-crosslinked polyimide dielectric films containing Cu elements for high-temperature film capacitors

Di Wu,Xin Zhao,Xiuting Li,Jie Dong,Qinghua Zhang

DOI: https://doi.org/10.1016/j.coco.2023.101653

IF: 8

2023-07-01

Composites Communications

Abstract:Organic polymers are widely used in film capacitors as they contain excellent flexibility, outstanding electrical insulating performance, fast charge-discharge rate, higher power density, etc. However, most of the commercially used polymer films suffer from poor heat resistance and low energy density, thus limiting their applications. To solve this problem, an effective method was adopted to prepare high-temperature resistant polyimide (PI) dielectric films in this work. A dual-crosslinked PI composite films containing Cu elements were fabricated by amine crosslinking agent and coordination of Cu 2+ with the N element in imidazole unit. The dielectric constant of the film increased from 4.00 to 4.88 at 1kHz, and the breakdown strength of the films increased from 437 MV/m to 460 MV/m at room temperature. The discharge energy density ( U d ) also reached the maximum of 3.12 J/cm 3 at 150 °C, and the charge-discharge efficiency ( η ) was 69.4% when the feeding content of Cu 2+ of 20% mol. It is worth mentioning that the form of coordination bond making Cu 2+ occupies the position of the lone pair electron, which effectively improved the hydrophobicity of PI composite films.

materials science, composites