Development of Lossy and Near-Lossless Compression Methods for Wafer Surface Structure Digital Holograms

Hongbo Zhang,Wenjing Zhou,Donald Leber,Zhijuan Hu,Xin Yang,Peter W. M. Tsang,Ting-Chung Poon
DOI: https://doi.org/10.1117/1.jmm.14.4.041304
2015-01-01
Journal of Micro/Nanolithography MEMS and MOEMS
Abstract:Lossy and near-lossless digital hologram compression methods are investigated to compress different complexities of wafer surface structures. In the lossy compression method, we apply row-and column-based uniform downsampling together with spline interpolation, whereas in the near-lossless compression method, we use wavelet local modulus maxima and spline interpolation. Results have shown that the lossy compression method is able to achieve a compression ratio of up to 100 for simpler wafer surface structures than that for complex surface structures. However, the near-lossless compression method is able to yield almost lossless compression even for complex wafer surface structures with a compression of about two. The proposed compression methods are computationally friendly for wafer surface structures as there is no time-consuming iterative computation involved. (C) 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
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