Soluble Polyimide-reinforced TGDDM and DGEBA Epoxy Composites

Qi Chen,Shun Wang,Feng Qin,Kuan Liu,Qian Liu,Qing Zhao,Xing-Yi Wang,Yan-Hong Hu
DOI: https://doi.org/10.1007/s10118-020-2395-9
2020-01-01
Chinese Journal of Polymer Science
Abstract:Polyimide (PI) synthesized from aromatic diamine and dianhydrides via two-step poly-condensation method was highly soluble in TGDDM (MY-720) and DGEBA (E-51) at desirable temperature. TGDDM-PI (M-PI) and DGEBA-PI (E-PI) composites within 0.5%-3% PI loading could be prepared without organic solvent. On the cryogenically fractured surfaces of M-PI and E-PI composites, no obvious heterogeneous phase was observed by SEM. The mechanical properties were promoted significantly by PI, especially for impact strength. Adding 2% PI-2W into MY-720 and E-51 composites, the impact strength increased to 21 and 51 kJ/m 2 , the tensile strength increased by 62% and 19%, and the flexural strength by 18% and 13%, respectively, with slight increases in tensile modulus. These results were related to the promotion in plasticity of composites and changes in fragile→ductile fracture mode. Moreover, T g and thermal stability of M-PI and E-PI were increased effectively.
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