Abstract:Two semi-alicyclic thermoplastic polyimides (PI) have been prepared from stereoisomeric hydrogenated pyromellitic dianhydrides, including 1S,2R,4S,5R-hydrogenated pyromellitic dianhydride (ccHPMDA or H-PMDA) and 1R,2S,4S,5R-hydrogenated pyromellitic dianhydride (ctHPMDA or Hʹʹ-PMDA) and a fluorine-containing diamine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (BDAF), respectively. The derived PI-1 (ccHPMDA-BDAF) and PI-2 (ctHPMDA-BDAF) resins were easily soluble in polar aprotic solvents, such as N -methyl-2-pyrrolidinone (NMP) and N,N -dimethylacetamide (DMAc) and meanwhile they also exhibited good thermoplasticities. Thus, the PI films (thickness: ~25 μm) and sheets (thickness: ~3 mm) were separately prepared from the PI solutions in DMAc and the PI powders, respectively. The stereoisomeric effects in the ccHPMDA-derived PI-1 and the ctHPMDA-derived PI-2 apparently affected the melt-flowability of the polymers. PI-2 exhibited lower melting viscosities than that of the PI-1 counterpart. The PI sheets exhibited obviously reduced optical transparency compared with those of the PI films; however better optical transparency than those of the common thermoplastic PI sheets. For example, PI-2 sheet showed the optical transmittance value at the wavelength of 760 nm (T 760 ) of 69.6%, which was 19.5% lower than that of the analogous PI-2 film (T 760 = 89.1%), however 50.3% and 65.7% higher than those of the commercially available PI-ref1 sheet (T 760 = 19.3%) derived from 3,3ʹ,4,4ʹ-oxydiphthalic dianhydride (ODPA) and 4,4ʹ-oxydianiline (ODA) and the PI-ref2 sheet (T 760 = 3.9%, Aurum ® PL450C, Mitsui Chem. Co, Ltd., Japan), respectively. Meanwhile, the PI-1 and PI-2 sheets showed the heat deflection temperatures (HDT) of 261.0 °C and 265.0 °C, respectively, which were obviously higher than those of the referenced PIs. At last, the PI sheets exhibited good mechanical properties, including high flexural strength (130.0 ~ 132.0 MPa), flexural modulus (2.87 ~ 2.96 GPa), compression strength (124.4 ~ 149.3 MPa), compression modulus (1.49 ~ 1.59 GPa), and impact strength (129.0 ~ 139.6 KJ/m 2 ).

Synthesis and Characterization of High Temperature Transfer Molding Polyimide Resins

High Thermally Stable and Melt Processable Polyimide Resins Based on Phenylethynyl-Terminated Oligoimides Containing Siloxane Structure

Phenylethynyl-terminated Oligoimides Based on Bis(p-Aminophenoxy)dimethyl Silane: Effect of Siloxane Structure on Processability and Thermal Stability

Synthesis and properties of thermoplastic polyetherimide resins modified by 1,4-bis(2,3-dicarboxyphenoxy)-2- tert -butylbenzene dianhydride (3,3′-TBHQDA)

Preparation and characterization of soluble heat-resistant polyimide films containing bis-N-phenyl-benzimidazole

Structure and Properties of Thermoplastic Polyimide Based on 4', 4'-(Oxybis (methylene)) Bis ([1.1'- Bipheny]3-Amine) Diamine

Solvent-resistant polyetherimide network systems via phenylethynylphthalic anhydride endcapping

Preparation and properties of semi-alicyclic thermoplastic polyimide sheets from stereoisomeric hydrogenated pyromellitic dianhydrides and fluorinated diamine

Synthesis and Characterization of Thermoplastic Polyether-imide Elastormer

Preparation of High-Temperature Resistant Polyimide Fibers by Introducing the p -Phenylenediamine into Kapton-Type Polyimide

Heat‐resistant and transparent polyimides derived from alicyclic dianhydrides and phthalazinone‐based diamine

Synthesis and properties of modified thermoplastic polyimide films with good dielectric properties at high frequency and enhanced thermal stability via incorporation of rigid ester and biphenyl structural units

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

Melt fluidity and thermal property of thermosetting siloxane-containing polyimide resins and their organic/inorganic hybrid characteristics

Synthesis and characterization of bisphthalonitrile-terminated polyimide precursors with unique advantages in processing and adhesive properties

Preparation and characterization of PMR-type polyimides from furan-based diamines

Study on Syntheses and Properties of Some Novel Polyimides Containing Bisthiazole Rings

Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins

Synthesis and Characterization of Organo-Soluble Polyimides Based on Polycondensation Chemistry of Fluorene-Containing Dianhydride and Amide-Bridged Diamines with Good Optical Transparency and Glass Transition Temperatures over 400 °C

Synthesis and properties of polyimides from a diamine containing side diphenylphosphine oxide and trifluoromethyl groups

Synthesis and properties of novel colorless and thermostable polyimides containing cross‐linkable bulky tetrafluorostyrol pendant group and organosoluble triphenylmethane backbone structure